SMT Assembly
FUJI high-speed placement machines for precise placement of SMD components.
FUJI NXT III 5x M6
High-performance and precise placement machine with 5 placement heads (CPH 100,000)- Supports a wide range of PCB sizes from 48 x 48 mm up to 610 x 610 mm
- Holds a large number of components (feeders) - 225 positions available for 8 mm feeders
- Mounting components from size 01005 (0.4 x 0.2 mm) up to components with a height of 38 mm
- Possibility of fitting components where vacuum cannot be used, so-called mechanical nozzles or completely individual custom nozzles
- Full traceability - advanced production data collection system
- Tray unit with support for up to 10 different tray pallets
FUJI Aimex II
High-performance and precise placement machine with 4 placement heads (CPH 75,000)- Supports a wide range of PCB sizes from 48 x 48 mm up to 759 x 686 mm
- Holds a large number of components (feeders) - 180 positions available for 8 mm feeders
- Mounting components from size 01005 (0.4 x 0.2 mm) up to components with a height of 38 mm
- Possibility of fitting components where vacuum cannot be used, so-called mechanical nozzles or completely individual custom nozzles
- Full traceability - advanced production data collection system
- Tray unit with support for up to 10 different tray pallets
FUJI Aimex II
High-performance and precise placement machine with 2 placement heads (CPH 50,000)- Supports a wide range of PCB sizes from 48 x 48 mm up to 759 x 686 mm
- Holds a large number of components (feeders) - 180 positions available for 8 mm feeders
- Mounting components from size 01005 (0.4 x 0.2 mm) up to components with a height of 38 mm
- Possibility of fitting components where vacuum cannot be used, so-called mechanical nozzles or completely individual custom nozzles
- Full traceability - advanced production data collection system
- Tray unit with support for up to 10 different tray pallets
Screen printing
Fully automatic screen printing machines for high-quality and precise solder paste printing.
MPM Momentum II HiE
Advanced printing system- Maximum PCB size 610×508 mm, thickness 0.2–6 mm
- Accuracy ±11 μm @ 6 Sigma
- Automatic placement of backup pins based on Gerber data
- Integrated dispenser for additional application of paste and glue
- SPI - 2D inspection of printed paste and inspection of clogging of holes in the plate
- Edge lock - possibility of printing PCBs without technological edge
- Non-contact paste temperature measurement
EKRA Serio 4000
Full automatic- Maximum PCB size 510×510 mm, thickness 0.2–6 mm
- Accuracy ±12.5 μm @ 6 Sigma
- Side clamp
- Automatic detection and refill of paste
EKRA Serio 4000
Full automatic- Maximum PCB size 510×510 mm, thickness 0.2–6 mm
- Accuracy ±12.5 μm @ 6 Sigma
- Automatic placement of backup pins
DEK Horizon 03i
Full automatic- Maximum PCB size 450×450 mm
- HawkEye® 2D optical inspection of printed paste
DEK Horizon 03
Full automatic- Maximum PCB size 450×450 mm
Inspection & control
Modern inspection equipment for 100% quality control in production.
Koh-Young 8030-2
3× in-line 3D SPI- 3D measurement of volume, area, height, offset, bridge and shape defects of solder paste
- Patented dual Moiré technology - significant reduction of ghosting and flare
- Warp compensation - accurate measurement of warped PCBs
- High inspection speed - 0.45 sec/shot
- Traceability - storing measurement values
Koh-Young Zenith
3D AOI- Fully 3D in-line AOI
- 8× moiré projection – shadow suppression
- 4 MPx camera, 20 μm lens, from 01005
- Detects a wide range of defects, including polarity, tombstone, lifted lead/body, bridging and OCV/OCR
- BGA and connector coplanarity inspection
Koh-Young Zenith 2
3D AOI- Fully 3D off-line AOI
- 3D measurement up to 25mm height without affecting accuracy
- 4x side camera for 3D reconstruction of hidden areas
- 8× moiré projection – shadow suppression
- Detects a wide range of defects, including polarity, tombstone, lifted lead/body, bridging and OCV/OCR
- BGA and connector coplanarity inspection
YXLON Cougar SMT
X-ray- 2D and 3D microfocal inspection
- Maximum sample size up to 440×550 mm
- Open type X-ray tube with resolution < 1 μm
- 5-axis manipulator with the possibility of measuring at an angle of ±70°
- VoidInspect - automatic calculation of voids in joints
XRHCount
X-ray component counting machine- SMD component counting machine in reels
- No more complicated manual counting
- The machine can handle 6 to 7 reels per minute.
- Automatic barcode recognition
Keyence VHX-X1
KEYENCE VHX-X1 digital microscope- Detailed visual inspection
- VHX-SL1F Base
- VHX-7100 microscope head, VHX-E100 and VHX-E20 objectives
- Microscope allows PCB quality control
Soldering
Reflow and wave soldering with nitrogen atmosphere for maximum joint quality.
REHM VXC Nitro 2450
2× Convection reflow- Convection hot air oven with nitrogen
- Stable process, water cooling zones
- Selectable feed rate
Ersa HOTFLOW 3/14e
2x Reflow soldering system- 9 zones: 5 preheating, 2 soldering, 2 cooling
- Lead-free soldering
- Wireless profilometer
- Max. PCB width 500 mm
Heller 1707 MKIII
N₂ atmosphere- 7 soldering zones + 1 cooling zone
- Max. PCB width 530 mm
- Temperature profile according to customer requirements
Nordson CURANO II
Convection reflow- Automatic width adjustment
- Outlet cooling fans
- Bottom curing
Ersa EWS 330
Wave soldering- Spray fluxer
- Double soldering wave: chip board + wave
- Dynamic preheating
- Max. PCB width 330 mm
- Nitrogen valve
Coating
Selective coating to protect PCBs in harsh environments.
Asymtek Select Coat® 940
2× Selective coating- High-speed and high-precision coating system
- Closed loop process control
- Max. PCB 421×400 mm
- Monitored pressures and flows
Robotics
Universal Robots collaborative robots for automating machine handling and operation.
Universal Robots UR10
1x UR10- 6-axis arm, reach 1.3 m
- Max load 10 kg
- Repeatability 0.05 mm
Universal Robots UR5
5× UR5- 6-axis arm, reach 0.85 m
- Max load 5 kg
- Repeatability 0.03 mm
- Double mechanical gripper
Laser marking
Precise PCB marking directly on the production line.
Nutek NTM5510-X
Laser marking system- CO2, 10 W, air cooling
- PCB 80×65 mm to 508×460 mm
- Text, barcodes, 2D codes, graphics
- CCD camera for readability control
- Double-sided marking
Nutek LMC-S3
Laser marking system- CO2, 10 W, air cooling
- 105 × 105 mm per position, total coverage 460 × 460 mm
- Text, barcodes, 2D codes, graphics
- CCD camera for readability control
- Double-sided marking
Storage
Automated storage with controlled atmosphere for sensitive components.
MYCRONIC SMD Tower
8× Automatic tower- Up to 980 reels (depending on type)
- 8–44 mm reels and JEDEC Tray
- Residual humidity up to 3.5% RH
- Expiration alarm and MSD components
- Material "at hand" at the push of a button
MP DRY CABINET
14× Drying cabinet- Drying cabinet according to IPC/JEDEC J-STD 033C
- Accuracy ±0.8% RH
- Graphical touch screen
- LAN connection for data
Washing & cleaning
Automatic washing of PCBs and stencils after soldering.
SuperSWASH
PCB washer- Linear spray – even coverage
- Air knife – convection drying
- Variable rinsing (DI-water, detergent)
- Traceability with code reader
MiniSWASH III
Stencil washer- 4-step washing with conductivity measurement
- Max. template 820×90×740 mm
- Washing stencils thinner than 100 μm
Stencilclean SIA
Stencil washer- Max. template 820×90×740 mm
- Washing stencils thinner than 100 μm
Milling & repairs
PCB prototype production and professional repair workshop.
LPKF ProtoMat S64
PCB milling machine- Max. material 305×229 mm
- 15 tools, automatic change
- Feed speed 150 mm/s
- Repeatability 5 μm
MARTIN 10.6 XL
Rework station- Automatic removal and placement of components
- Bottom preheating max 5,000 W
- Hot air nozzles 300 W, up to 32 l/s
- Max. plate 500×600 mm
- Adjustable soldering profiles
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